multilayer ceramic chip capacitors 1 of 3 creation date : june 29, 2017 (gmt) cga4j3x5r1h474k125ab tdk item description cga4j3x5r1h474kt**** applications automotive grade feature general general (up to 50v) aec-q200 aec-q200 series cga4(2012) [eia 0805] status production (not recommended for new design) size length(l) 2.00mm 0.20mm width(w) 1.25mm 0.20mm thickness(t) 1.25mm 0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 470nf 10% rated voltage 50vdc temperature characteristic x5r(15%) dissipation factor (max.) 5% insulation resistance (min.) 1063m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : june 29, 2017 (gmt) cga4j3x5r1h474k125ab characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cga4j3x5r1h474k125ab esr cga4j3x5r1h474k125ab capacitance cga4j3x5r1h474k125ab dc bias characteristic cga4j3x5r1h474k125ab temperature characteristic cga4j3x5r1h474k125ab(no bias) cga4j3x5r1h474k125ab(dc bias = 25v ) ripple temperature rising cga4j3x5r1h474k125ab(100khz) cga4j3x5r1h474k125ab(500khz) cga4j3x5r1h474k125ab(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : june 29, 2017 (gmt) cga4j3x5r1h474k125ab associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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